Aeroflex  MG200

Aeroflex MG200 is a thermally conductive liquid gap filling materials, two-component, cured either at room or elevated temperature. Prior to curing, the material maintains good thixotropic characteristics, easy to dispense. The result is a soft, form-in-place elastomer ideal for interfacing fragile components with high topography and/or stack-up tolerances to a universal heat sink or housing. After cure, it won't pump from the interface as a result of thermal cycling and is dry to the touch.

Product Description Typical Property Data

FEATURES & BENEFITS 

  • Thermal conductivity 2.0 W/m·K
  • Various types of thermal conductivity are available for selection and customization
    Easy to dispense
  • Two-part formulation for easy storage
  • Ultra-conforming-hardness
  • RoHS compliant
  •  

TYPICAL APPLICATIONS 

  • Automated Electronic Control Units (ECU's & BMS)
  • Power Supplies & Semiconductors
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Flat Panel Displays & Consumer Electronics

 

CONFIGURATIONS  AVAILABLE

  • Syringe (50, 400 cc) or kit form. 

PERFORMCE CURVE
FC@PROPERTIES FC@UNIT MG200
- - A B
Appearance - Pink White
The Mixing Ratio - 1:1
Viscosity cps 300000
Viscosity After Mixing cps 300000
Minimum Use Thickness mm 0.05
Operating Time@25°C min 10~600
Curing Time(90%) min @100℃ 5~60
h @25℃ 1~72
    PROPERTY AS CURED
Hardness Shore OO 70
Thermal Conductivity  W/m·K 2.0
Thermal Resistance @50psi °C·in²/W ≤0.08
Dielectric Strength (@1MM) kV ≥9
Volume Resistivity Ω·cm ≥1.0X1012
Density g/cm³ 2.9
Dielectric Constant @1MHz 6.8
Small Molecule Cyclosiloxane (D4-D20) ppm ≤100
CTE (Coefficient Thermal Expansion) ppm/°C -
Flammability Rating UL. 94 V-0
Continuous Use Temperature °C -60~+200
RoHS Compliant - YES