Aeroflex TG861 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.
FEATURES & BENEFITS
TYPICAL APPLICATIONS
CONFIGURATIONS AVAILABLE
|
PERFORMCE CURVE |
FC@PROPERTIES | FC@UNIT | FC@TEST METHOD | TG861 |
---|---|---|---|
Appearance | - | Visual | Gray |
Flow Rate | g/min | Aerobon | 20 |
Thermal Conductivity | W/m·K | Hot Disk | 6.0 |
ASTM D5470 | 6.0 | ||
Thermal Resistance (@1mm,20psi) |
°C·in²/W | ASTM D5470 | 0.032 |
°C·cm²/W | 0.206 | ||
Min.Used Thickness | mm | Aerobon | 0.08 |
Flame Rating | - | U.L | 94V-0 |
Volume Resistivity | Ω·cm | ASTM D257 | ≥1.0X109 |
Density | g/cm³ | ASTM D792 | 3.25 |
Dielectric Constant | @1MHz | ASTM D150 | 13.5 |
TML(CVCM) | % | ASTM E595 | ≤0.12(0.01) |
Low volatility content (D4-D20) | ppm | Gas Chromatograph | <20 |
Service Temp | °C | Aerobon | -60~200 |
RoHS Compliant | - | Aerobon | YES |