Aeroflex TG860


Aeroflex TG860  is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. In addition to providing application flexibility and variable gap adaptation, Aeroflex TG860 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. 
It requires no cure cycle and its cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

Product Description Typical Property Data

FEATURES & BENEFITS 

  • Thermal conductivity 6.0 W/m·k
  • Ultra low thermal resistance 
  • Easy to dispense
  • Ultra low compression force
  • Long-term reliability
  • RoHS compliant
  •  

TYPICAL APPLICATIONS 

  • Automotive Electronic Control Units (ECU's)
  • Power Supplies & Semiconductors
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Flat Panel Displays & Consumer Electronics
  •  

CONFIGURATIONS AVAILABLE

  • 30cc,55cc,300cc syringe
  • 1kg,10kg Filling
     

PERFORMCE CURVE

FC@PROPERTIES FC@UNIT FC@TEST METHOD TG860
Appearance - Visual Gray
Flow Rate g/min Aerobon 15
Thermal Conductivity W/m·K Hot Disk 6.0
ASTM D5470 6.0
Thermal Resistance
(@1mm,20psi)
°C·in²/W ASTM D5470 0.04
°C·cm²/W 0.26
Min.Used Thickness mm Aerobon 0.08
Flame Rating - U.L 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X109
Density g/cm³ ASTM D792 3.25
Dielectric Constant @1MHz ASTM D150 13.5
TML(CVCM) % ASTM E595 ≤0.12(0.01)
Low volatility content (D4-D20) ppm Gas Chromatograph <20
Service Temp °C Aerobon -60~200
RoHS Compliant - Aerobon YES