Aeroflex TG860 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. In addition to providing application flexibility and variable gap adaptation, Aeroflex TG860 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer.
It requires no cure cycle and its cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.
FEATURES & BENEFITS
TYPICAL APPLICATIONS
CONFIGURATIONS AVAILABLE
|
PERFORMCE CURVE |
FC@PROPERTIES | FC@UNIT | FC@TEST METHOD | TG860 |
---|---|---|---|
Appearance | - | Visual | Gray |
Flow Rate | g/min | Aerobon | 15 |
Thermal Conductivity | W/m·K | Hot Disk | 6.0 |
ASTM D5470 | 6.0 | ||
Thermal Resistance (@1mm,20psi) |
°C·in²/W | ASTM D5470 | 0.04 |
°C·cm²/W | 0.26 | ||
Min.Used Thickness | mm | Aerobon | 0.08 |
Flame Rating | - | U.L | 94V-0 |
Volume Resistivity | Ω·cm | ASTM D257 | ≥1.0X109 |
Density | g/cm³ | ASTM D792 | 3.25 |
Dielectric Constant | @1MHz | ASTM D150 | 13.5 |
TML(CVCM) | % | ASTM E595 | ≤0.12(0.01) |
Low volatility content (D4-D20) | ppm | Gas Chromatograph | <20 |
Service Temp | °C | Aerobon | -60~200 |
RoHS Compliant | - | Aerobon | YES |