Aeroflex TG801


Aeroflex  TG801 is specially designed for use in high performance devices requiring minimal thermal resistance for maximum thermal performance and component reliability. It requires no cure cycle and can be readily re-worked. This compliant material requires low compression force to conform to irregular interfaces and can be applied to single devices with minimum bond-line thickness as well as to multiple devices with variable tolerances. The cross-linked gel structure provides superior long term thermal stability and reliable performance to conventional greases.

Product Description Typical Property Data

FEATURES & BENEFITS 

  • Thermal conductivity 3.0 W/m·k
  • Ultra low thermal resistance 
  • Easy to dispense
  • Ultra low compression force
  • Long-term reliability
  • RoHS compliant
  •  

TYPICAL APPLICATIONS 

  • Automotive Electronic Control Units (ECU's)
  • Power Supplies & Semiconductors
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Flat Panel Displays & Consumer Electronics
  •  

CONFIGURATIONS AVAILABLE

  • 30cc,55cc,300cc syringe
  • 1kg,10kg Filling
     

PERFORMCE CURVE

FC@PROPERTIES FC@UNIT FC@TEST METHOD TG801
Appearance - Visual Light yellow
Flow Rate g/min Aerobon 26
Thermal Conductivity W/m·K Hot Disk 3.0
ASTM D5470 3.0
Thermal Resistance
(@1mm,20psi)
°C·in²/W ASTM D5470 0.08
°C·cm²/W 0.52
Min.Used Thickness mm Aerobon 0.08
Flame Rating - U.L 94V-0
Volume Resistivity Ω·cm ASTM D257 ≥1.0X1013
Density g/cm³ ASTM D792 3.00
Dielectric Constant @1MHz ASTM D150 6.8
TML(CVCM) % ASTM E595 ≤0.20(0.08)
Low volatility content (D4-D20) ppm Gas Chromatograph <80
Service Temp °C Aerobon -60~200
RoHS Compliant - Aerobon YES