Aeroflex S22P


Aeroflex S22P is a thermally conductive silicone gel pad with a good combination of high thermal conductivity and compressibility. This soft gel pad provides reduced interfacial thermal resistance, along with shock absorption and ease of use. It’s unique silicone and filler combination has extremely low silicone extractables compared to many other silicone interface products. It is ideal for use to fill gaps between high-power, heat-generating components and related heat sinks, boards or chassis.

Product Description Typical Property Data

FEATURES & BENEFITS 

  • Thermal conductivity 2.2 W/m·K
  • Available in thicknesses from 0.006” (0.15mm) to 0.400” (10.0mm)
  • Integrated polyimide-liner provides dielectric strength Resistant to shear and mechanical forces
  • Soft and compressible for low stress applications
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TYPICAL APPLICATIONS 

  • Automated Electronic Control Units (ECU's)
  • Power Supplies & Semiconductors
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Flat Panel Displays & Consumer Electronics

SELECTION GUIDE

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PROPERTIES

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UNIT

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TEST METHOD

S22 S22F S22W

Appearance

-

Visual

Dark Grey

Grey

Light Grey

Thickness

mm ASTM D374 0.15~10.0 0.15~10.0 0.15~10.0

Thermal Conductivity

W/m·K Hot Disk 2.20 2.20 2.20
ASTM D5470 2.20 2.20 2.20

Thermal Resistance (@1mm, 20psi)

°C·in²/W ASTM D5470 0.75 0.70 0.75
°C·cm²/W 4.85 4.52 4.85

Hardness

Shore OO ASTM D2240 50 40 50

Flame Rating

- U.L 94V-0 94V-0 94V-0
Dielectric Strength (@1MM) kV ASTM D149 >9.0 >10.0 >9.0

Volume Resistivity

Ω·cm ASTM D257 ≥3.0X1013 ≥3.0X1013 ≥3.0X1013

Density

g/cm³ ASTM D792 2.60 2.60 2.60

Tensile Strength

psi ASTM D412 36 - 36

Elongation

% ASTM D412 55 - 55

Compression Deflection (%) at given pressure

10psi ASTM D575 12 12 12
50psi 42 42 42
100psi 58 58 58

Dielectric Constant

@1MHz ASTM D150 7.5 7.5 7.5
TML (CVCM) % ASTM E595 ≤0.32(0.08) ≤0.32(0.08) ≤0.32(0.08)

Service Temp.

°C Aerobon -60~200 -60~200 -60~200

RoHS Compliant

- Aerobon YES YES YES