Aeroflex S12

Aeroflex S12  is a cost-effective, thermal gap pad, with an ideal filler blend that gives it low modulus maintaining optimal thermal performance while allowing easy handling.  The natural tack on both sides of the material allows good compliance to adjacent surfaces of components, minimizing interfacial resistance.The filler allows the product to remain a cost effective solution where moderate thermal performance is acceptable.

Product Description Typical Property Data

FEATURES & BENEFITS 

  • Thermal conductivity 1.2 W/m·K
  • Available in thicknesses from 0.003” (0.07mm) to 0.400” (10.0mm)
  • Naturally tacky & re-workable
  • Soft and compressible for low stress applications
  •  

APPLICATIONS

  • Automated Electronic Control Units (ECU's)
  • Power Supplies & Semiconductors
  • Memory & Power Modules
  • Microprocessors / Graphics Processors
  • Flat Panel Displays & Consumer Electronics

Ordering Guide

  • 470×470 mm,sheet form and die-cut parts could be required.
  • 0.50 through 10.0 mm thick material available in 0.25mm increments

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PROPERTIES

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UNIT

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TEST METHOD

 S12

Appearance

 -

Visual

Grey

Thickness

 mm ASTM D374 0.07~10.0

Thermal Conductivity

 W/m·K Hot Disk 1.20
ASTM D5470 1.20

Thermal Resistance (@1mm, 20psi)

 °C·in²/W ASTM D5470 1.15
°C·cm²/W 7.42

Hardness

 Shore OO ASTM D2240 55

Flame Rating

 - U.L 94V-0
Dielectric Strength (@1MM) kV ASTM D149 >10.0

Volume Resistivity

 Ω·cm ASTM D257 ≥4.0X1013

Density

 g/cm³ ASTM D792 1.75

Tensile Strength

 psi ASTM D412 48

Elongation

 % ASTM D412 60

Compression Deflection (%) atgivenpressure

 10psi ASTM D575 10
50psi 42
100psi 58

Dielectric Constant

 @1MHz ASTM D150 5.5
TML (CVCM) % ASTM E595 ≤0.35(0.12)

Service Temp.

 °C Aerobon -60~200

RoHS Compliant

 - Aerobon YES