Thermal Adhesive Tape - TCXXB10

TC high temperature thermal double-side adhesive tape - TCXXB10 pressure-sensitive thermal adhesive tape has excellent heat-conducting property. Its common use is between the heat source and heat sink. This thermal material possesses good thermal conductivity, high breakdown voltage, adhesion and conform ability. Product has release paper on the one side, and protection film on the other side. Die-cut is easy for process.

Product Description Typical Property Data

Product Characteristic

Providing a convenient, reliable, and cleaner way to bond heat component and heat sink.
Suitable for high thermal conducting application between the heat  and cooling components.
Suitable for bonding between different interfaces.
Reliable adhesion, thin, and flexible.

Application Occasion

Assembly between heat sink and PCB  needing fasteners.
Directly applied to the enclosure, metal or ceramic packaging device, GPU, power switch, between the heat sink and PCB.
High integration, limited design space and difficulty to lock. 
Providing heat transfer, insulation and fixation.

Application Guide

The recommended service temperature is 20 ~ 27 ℃, and the bonding surface shall be clean.Before using the adhesive tape, the sticky surface shall be clean and dry.
Use the non-woven fabric daubed with IPA to wipe and remove the surface dust, fingerprint and other pollutants. 
Wear gloves to avoid further contamination. Before sticking the adhesive tape, keep it still for a few minutes to keep the surface dry.
Before the product is stuck, in order to avoid the entry of air, the adhesive tape can be pressed using a rubber roller to ensure it's smoothly stuck to the product surface. After one side of the product has been pasted, the release paper can be taken off.
In order to ensure the favorable bonding between the bonding surfaces, they can be appropriately pressed. The pressure, pressing time, and operating temperature shall conform to the product design requirement.
Characteristic TC-150B10 TC-250B10 TC-500B10 TC-1000B10 Testing method
Substrate Acrylic acid Acrylic acid Acrylic acid Acrylic acid -
Thickness mm 0.15 0.25

0.5

 1.0 BS3924
Colour White White White White -
Tensile strength kg/cm 0.08 0.15 0.30 0.80 BS3924
Extension rate% 400 400

500

 400 BS3924

Peel force Kg/25mm 

30min R.T.

 1.2 1.4 1.5 1.7 BS3924
Shear adhesion force Kg/cm2 3.5 3.5 3.5 4.5 ASTMD-1002
Thermal conductivity W/m·K 0.5

1.0

1.0

 1.0 DINV 54462
Breakdown voltage Kv 3.5 6.0 8.0 8.0 ASTMD-149
Working temperature °C -25~130 -25~130 -25~130 -25~130 -
Flammability rating V2 V0 V0 V0 UL 94
The protective layer Release Paper/Film Release Paper/Film Release Paper/Film Release Paper/Film -