Copper Foil - EFTAP-01

The purity of EFTAP-01 copper foil is higher than 99.95%. Its EMI shielding performance in electronic design is excellent.  Products are commonly used in ESD and grounding. The EFTAP-01 EMI shielding consists two parts, E-field and H-field. E-field shielding is realized through the excellent conductivity of the cooper, while H-field shielding is realized relying on the conducting material "nickel" on the surface of the copper foil tape. Product is widely used in mobile phones, notebook computers and other digital products.

Typical Property Data Product Structure Product Description
PROPERTIES EFTAP01-003     EFTAP01-005     EFTAP01-008 TEST METHOD
thickness mm 0.03  0.05  0.08 Thickness gauge
width mm 310 (Subject to availability) -
length m  50/100 (Subject to availability) -
Adhesive mm Single or Double side adhesive available: conductive/PSA (0.035) -
180°Peel strength kg/inch ≥1.0 kg/inch GB/T2792-1998
resistance Ω/sq inch ≤0.06 Ω/sq inch 25mmx25mm
Shielding effectiveness 100MHzdB ≥70  SJ 2054-1995
Fatigue Strength Hour ≥24 Hour GB/T4851-1998
Initial Strength cm <15cm GB/T4852-1984
Operating Temperature (w/o PSA) -40°-240° -
Operating Temperature (w/ PSA) -10°-120° -

Product Characteristics

Excellent conductivity and low resistance
Easy for die-cutting
Easy for installation
Different packaging, roll or sheet

Product Application

Extensively used in automobiles and electronics
Mobile telephone, notebook computer
Housing, LCD monitor
Electronic chassis, indoor chassis
Industrial equipment, mobile communication equipment etc.

Use Instructions

The application surface must be clean, free of any residues and grease. If necessary, the mounting surface shall be polished using sand paper or appropriate solvent.
Before use, the protection liner shall be removed. After applying the foil, it shall be pressed using 2KG pressure to ensure there is no gap between the adhesive and contact surface.
In room temperature, bonding can be completely after 24 hours.
The ideal temperature for applying the tape is 10℃ to 35℃. It's recommended that the assembly surface shall not be lower than 10℃; otherwise, the adhesion will not be firm, because the adhesive is hard. If the foil tape has been installed at room temperature, the bonding performance will usually not be affected at a lower temperature. If the tape needs to be used at a natural low temperature, it is recommended left at about 27℃ room temperature for over three hours first to reach its maximum performance.