Non-woven Fabric Base Material - ECTAP - N


ECTAP - N single-side / double-side conductive non-woven fabric series EMI single-side conductive non-woven fabric adhesive tape is composed of the non-woven fabric with good conductivity and air permeability as well as the conductive pressure-sensitive adhesive with fine cohesiveness. It has good conductivity, meet strict application requirement and realize stable earth shield. The non-woven fabric base material of the conductive non-woven fabric product is light in texture, soft, air permeable, and easy to be processed and molded, and can be closely stuck to a curved surface. The non-woven fabric surface is plated with conductive particles using the latest electroplating technology, providing it with fine conductivity. The conductive adhesive of the conductive non-woven fabric has good binding power and conductivity to various base materials, such as metal, FPC, and engineering plastics. It can still maintain excellent all-sided conductivity and binding power to the base material in the high temperature, high humidity and high salt mist environment. The ultrathin design is particularly suitable for FPCB earthing and EMC. The product has various thickness to be chosen by the customer.

Typical Property Data Product Structure Performance Curve Product Description
ECTAP-N-0.03 ECTAP-N-DC-0.03 ECTAP-N-HL-005
0.03 0.05 ASTM D3652
≥800 ASTM D3330
≤0.05 MIL-G-83528
≤0.05 ≤0.1 ASTM F390
≥60 MIL-DTL-83528
-20~85 -

Product Characteristic

Favorable EMI shielding effectiveness
Highly sticky to the uneven bonding surface
Excellent flexibility, easy for processing and molding
Outstanding bonding property in extreme environment
Customizable thickness; the thinnest one is 0.01mm.
Customizable flame retardant material, meeting the requirement of 94-V0
Different adhesives can be used on the back.

Product Application

EMC application, such as earthing and shielding
Electrostatic discharge
FPC bonding / FPC earthing