Fiber Glass Substrate Layer - ECTAP-T


Aerobon ECTAP-T single-side/double-side conductive tape is composed of the conductive fabric glass and the conductive pressure-sensitive adhesive. The product has good conductivity and shielding effectiveness.
The core conductive fabric layer provides structural strength, flexibility, and is easy for die-cutting processing. The fiber surface is electroplated with conductive particles, which provides continues conductivity. The conductive adhesive layer has strong bonding strength and offers good conductive to various base materials like the metal, circuit board and engineering plastics, even in the high temperature, high humidity and high salt environments. Products are suitable for EMI shielding and ESD grounding and has various thickness for selection.

Typical Property Data Product Structure Performance Curve Product Description
PROPERTIES ECTAP-T-C-005 ECTAP-T-DC-005 ECTAP-T-HL-005 TEST METHOD
Model/Thickness mm 0.05mm ASTM D3652
180°Peel strength gf/25mm ≥800 Strong Side: ≥800 / Weak Side: 200-600 ASTM D3330
Contact resistance Ω ≤0.05 MIL-G-83528
Surface resistance Ω/sq ≤0.07 ASTM F390
Shielding effectiveness dB ≥60 MIL-DTL-83528
proper temperature (℃) -20~85 -

Product Characteristic

Low contact resistance, high electromagnetic shielding
Highly sticky to the bonding surface
Excellent flexibility, easy for processing and moldingHaving passed the accelerated aging test, with excellent reliability
Customizable thickness; the thinnest one is 0.018mm.
Customizable flame retardant material, meeting the requirement of UL94-V0
Different adhesives can be used on the back.

Product Application

Mobile phone and other mobile electronic devices, such as GPS, VR, notebook computer etc.
Electromagnetic shielding of chip module and other core parts, such as FPC, and CPU
Wireless equipment