AERO-CURE CG-5020, an Aerobon proprietary product, is a high temperature curing Ag/Ni conductive FIP gasket. With guaranteed adhesion strength and conductivity, it features high EMI shielding effectiveness. High speed dispensing does not affect cross section shape.
Featured excellent conductivity, good elasticity and low compression set,AERO-CURE CG-5020 has good adhesion strength on metal and plastic surfaces. The product is cost-effective and can be applied to defense and critical industrial applications.
Features and Benefits
Dispensing Size
Note:
|
Compression-Deflection Curve H0.9mm*W1.1mm*L10mm, D-shaped strip |
FC@PROPERTIES | FC@UNIT | FC@TEST METHOD | CG-5020 |
---|---|---|---|
Benefit | - | - | Low Temperature Curing |
Conductive Materials | - | - | Ag/Ni |
Base Material | - | - | Silicone |
Curing Conditions | - | - | High temperature curing |
Curing Temperature | ℃ | - | 100 |
Curing Time | - | - | 4h |
Hardness | Shore A | ASTM D2240 | 55 |
Tensile Strength | PSI | ASTM D412 | 150 |
Elongation | % | ASTM D412 | 100 |
Density | g/cm³ | ASTM D792 | 3.9 |
Volume Resistivity | ohm-cm | MIL-DTL-83528C | 0.01 |
Compression Rate @ 100 ℃ for 70 hours | % | ASTM D395-B | 30 |
Working Temperature | ℃ | - | -55~+150 |
Flame Retardant Grade (Between aluminum plates) | - | UL 94 | V-0 |
Shielding Effectiveness (AVG 200mhz-18ghz) | dB | MIL-DTL-83528C | >90 |
Adhesive Point Size W1.1*H0.9*L10mm | N/cm | Aerobon QA-WI-054 | 15 |
Dispensing Size @30% compression, W1.1*H0.9*L10mm | N/cm | Aerobon QA-WI-058 | 28 |
Minimum Recommended Value / Maximum Recommended Value of Dispensing Size |
mm | Width * Height |
0.5*0.4/ 2.5*1.7 |
Storage Time | Month | - | 6 |
Storage Conditions | ℃ | - | -30~-10 |