Enterprise informatization, social media, interactive games, and the booming trend of 5G (and related new applications) continue to promote the rapid growth of data centers.

The number of data centers is not only growing, but also in terms of data transmission and exchange rate, operating frequency and corresponding power density.

As these challenges become more complex and affect each other, Aerobon’s electromagnetic shielding EMI and heat dissipation solutions can help customer design engineers solve all problems from router signal interference to the rising thermal load of chips and modules.

• Rack components
Server/switch/router

Aerobon has been serving this market for decades, and provides the most extensive and most advanced radiated/conducted EMI and thermal interface material and cooling module solution portfolio. For example, the size and thermal density of ASICs continue to increase.

Aerobon provides the highest Tc and highly reliable thermal conductive materials on the market. As EMI and thermal conduction issues become more complex and require more comprehensive thinking, a comprehensive EMI and heat dissipation solution combination becomes more and more valuable.

In these cases, EMI shielding and absorption solutions, thermal interface materials, and cooling module solutions must work together to solve problems such as router signal interference and complex heat transfer scenarios.

From simulation to rapid prototyping and rapid mass production delivery, Aerobon uses our competitive advantages to provide customers with appropriate solutions to their heat dissipation and EMI challenges.

The products provided by Aerobon include: thermally conductive absorbing materials, absorbing materials, conductive rubber, conductive glue FIP, metal finger reeds, thermal interface materials, thermally conductive glue, FOF wrapped foam.

• Pluggable/connector
5G accelerator card, SSD, network card, optical module, backplane

Some industry associations are increasingly advancing the generalization and standardization of these devices, and the application of pluggable devices is further accelerating and becoming a source of hardware customization and differentiation.

The experts of Aerobon are ready to deal with the EMI and heat dissipation challenges encountered in the structural design of these pluggable devices (from optical transceivers to accelerator cards) in various dimensions.

The products provided by Aerobon include: thermally conductive absorbing materials, absorbing materials, conductive rubber, conductive glue FIP, metal finger reeds, thermally conductive interface materials, thermally conductive glue, FOF wrapped foam.