Aerobon provides the most innovative, reliable and scalable effective electromagnetic shielding EMI and thermal management solutions for consumer and portable electronic devices.

Aerobon's broad product portfolio covers comprehensive solutions from electromagnetic shielding EMI materials and devices, to thermal interface materials, to heat dissipation modules, and multi-functional solutions that include a single process design.

Our advanced materials and different combinations of materials, material processing and assembly technology can realize the miniaturization of customer components and the automation of the production process.

Our high-performance heat dissipation and EMI shielding materials can help equipment and system manufacturers solve the temperature rise and EMI problems caused by the increasing functionality of consumer electronic devices.

Aerobon has advantages in simulation, modeling, rapid prototyping and laboratory testing in the early design stage. Our first-class engineering expertise can speed up our customers to achieve rapid development and market launch of their products.

•Notebooks, tablets and mobile phones

The development trend of notebook computers and tablet computers is to have higher performance, more eye-catching multi-function capabilities, miniaturization, fast battery charging and long-term battery life.

In order to support the work of design engineers, Aerobon provides products and multifunctional integrated solutions for anti-electromagnetic interference EMI, thermal interface materials, heat dissipation modules and precision metal stamping structural parts.

In addition, we can flexibly create product designs to meet customer safety requirements, online inspections, and appearance standards.

Products provided by Aerobon: thermal interface materials, metal precision stamping parts, conductive foam FOF, SMD conductive foam, conductive tape, metal shield, metal grounding SMD shrapnel, wave absorbing material, thermal conductive wave absorbing material, multifunctional Assembly (EMI + heat dissipation + structure)

•Game console and mining machine

Every year, the next generation of game consoles promises to be thinner, faster and more powerful-and these put forward higher requirements for the performance of game consoles. Accordingly, when engineers design game consoles, electromagnetic Interference EMI and thermal management are facing increasing challenges in the functional realization and reliability of equipment.

The ever-increasing power density of game consoles has promoted the demand for higher thermal conductivity materials, and engineers have also carried out more thermal management innovations. Integrating tighter functions and power into a smaller space not only encounters heat dissipation problems, but also encounters EMI "noise" problems.

The development of mining machines is the same as the development of game consoles, with the same challenges of heat dissipation and EMI issues.

Aerobon provides innovative solutions to alleviate EMI interference problems, and at the same time, it can effectively transfer unnecessary heat in a narrow and reduced space to solve the heat dissipation problem.

Products provided by Aerobon: thermal interface materials, metal precision stamping parts, conductive foam FOF, SMD conductive foam, conductive tape, metal shield, metal grounding SMD shrapnel, wave absorbing material, thermal conductive wave absorbing material, multifunctional Assembly (EMI + heat dissipation + structure), heat dissipation module.

•Computer peripheral equipment

The rapid development of computer peripherals and all-in-one printers, Bluetooth smart speakers, and projection technology has gradually realized the pace of "Internet of Everything", which is equivalent to expanding

Functions of computers and laptops.

Multi-function requirements such as intelligence and wireless interconnection need to design modules for control. Generally, control modules or wireless control units need to be integrated into a single device at a high density.

This encounters EMI and heat dissipation issues.

Among them, our advanced thermal interface materials transfer heat from the hot IC or components on the PCB to the housing.

Our EMI shielding materials can protect your equipment to meet EMC compliance requirements everywhere.

Products provided by Aerobon: thermal interface materials, metal precision stamping parts, conductive foam FOF, SMD conductive foam, conductive tape, metal shield, metal grounding SMD shrapnel, wave absorbing material, thermal conductive wave absorbing material, multifunctional Assembly (EMI + heat dissipation + structure), heat dissipation module.

•AR technology and equipment

Soon, augmented reality (AR) and virtual reality (VR) systems and headsets are expected to bring amazing new experiences to our daily lives.

Mass data transmission of images and videos requires high-speed data links and higher chip processing capabilities. At the same time, AR and VR headsets need to be lighter, longer battery life, and tighter functional integration, all of which need to be completed in a smaller space. This requires a holistic approach to understand system-level electromagnetic interference EMI and heat dissipation issues. The most important thing is that these problems must be solved at the same time in the early design stage.

Aerobon’s extensive product portfolio includes high-performance thermal interface materials, conductive foam, conductive cloth tape, metal precision structural parts, grounding reeds, shielding covers and other board-level shielding and multi-functional solutions, all of which are designed to Enable design engineers to help create more immersive experiences in AR and VR.