5G wireless communication technology

5G wireless communication technology provides enhanced mobile broadband (eMBB), ultra-reliable and low-latency communication (URLLC), and a large number of various types of communication equipment (mMTC), enabling the rapid development of artificial intelligence and Internet of Things technology.

Compared with LTE-4G, 5G wireless provides a higher baseband frequency and will continue to expand to 30Ghz and higher. However, 5G wireless technology baseband and other core chipsets, radio frequency modules and components consume more power due to higher data processing requirements, which makes 5G AAU and other telecommunication equipment (CU, DU) thermal management and EMI suppression capabilities More challenging.

Thanks to Aerobon Technology's years of focus on telecommunications and 5G wireless fields and accumulated rich experience, we have introduced advanced heat dissipation and EMI solutions, including integrated solutions, to help telecom engineers to easily deal with the heat dissipation and EMI challenge.

• AAU 

5G AAU is usually installed on the top of buildings or on high poles outdoors. Compared with RRU, 5G AAU integrates active MIMO antenna array. Due to strict control of size and weight, and better adaptation to harsh application environments, its power consumption is 2-3 times that of RRU.

In order to minimize the radio frequency transmission loss of MIMO antennas (especially antennas with a wavelength less than 10 mm), Hangke Gubang has developed high-performance, high-reliability thermal interface materials and electromagnetic shielding materials to cope with the critical heat dissipation in AAU And the challenge of EMI. To

The products provided by Aerobon include: absorbing materials, conductive rubber, sealing rubber, conductive glue FIP, metal finger reeds, thermal interface materials, thermally conductive graphite wrapped foam.

• Cellular/5G small cell base station

Small base stations and 5G micro base stations are used to enhance AAU transmission signals in designated areas. The compact design requirements of small base stations and high-frequency RF modules and components will cause heat and EMI problems.

Aerobon provides a series of electromagnetic shielding and thermal interface materials, which can help design engineers easily solve EMI problems and heat dissipation problems in small cells and 5G micro cells.

The products provided by Aerobon include: absorbing materials, conductive rubber, conductive glue FIP, metal finger reeds, thermal interface materials, thermal conductive glue, FOF wrapped foam, and thermally conductive graphite wrapped foam.

•5G The optical transceiver module and the high-speed connector

• The optical transceiver module and the high-speed connector SFP+/SFP28 optical module in the 5G fronthaul are widely used in the 5G fronthaul transmission to transmit optical signals between AAU and DU. Due to the harsh outdoor environment, the LD chipset and controller IC in the optical transceiver module are highly sensitive to temperature, so effective thermal solutions are needed. The space of the optical module is very small, and complicated EMI problems and heat dissipation problems have always plagued engineers. The interface problems of high-speed connectors require electromagnetic shielding, and a large amount of data transmission also brings heat dissipation problems. Aerobon provides design engineers with reliable materials needed to manage the heat conduction and EMI problems in optical transceiver modules. At the same time, we have professional solutions and reliable products for EMI problems and heat dissipation problems of high-speed connectors. The products provided by Aerobon include: thermally conductive absorbing materials, absorbing materials, conductive rubber, conductive glue FIP, metal finger reeds, thermal interface materials, thermally conductive glue, FOF wrapped foam.

    •5G DU/CU

The 5G baseband equipment (DU/CU) is designed for large-scale and complex network deployments.

Aerobon provides a variety of high-performance materials to manage heat dissipation and EMI issues in DU/CU equipment.

The products provided by Aerobon include: thermally conductive absorbing materials, absorbing materials, conductive rubber, conductive glue FIP, metal finger reeds, and thermally conductive interface materials.

• 5G core network (high-end/large router)

The core network can transmit call requests or data requests from different ports to different networks, which usually requires big data processing capabilities.

To ensure reliable data processing, ASIC/FPGA chipsets and complex cell designs require high-performance materials to solve the problems of heat dissipation and EMI.

The products provided by Aerobon include: thermally conductive absorbing materials, absorbing materials, conductive rubber, conductive glue FIP, metal finger reeds, and thermally conductive interface materials.